Wednesday, November 12, 2014

Amkor Technology - Semiconductor Services

A technology innovator in packaging and test solutions. The pakaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions.

They offer test services for many devices and designs that are used in Mordern day Electronic Gadgets that have application specific integrated circuits, memory devicea, and mixed signal and RF sections.

Amkor Technology - Semiconductor Services

Amkor also offers IC and Semiconductor Test Services. The also provide IC Package Design Services and complete turnkey solutions.

Amkor Flip Chip BGA (fcBGA) packages are assembled around state-of-the-art, single unit laminate or ceramic substrates.

Flip Chip BGA - Amkor Technology

This IC packaging technology is applicable for high pincount and / or high performance ASICs.

The variety of fcBGA package options allows package selection to be tailored to the specific thermal needs of the end product.

Flip Chip BGA - fcBGA

Amkor Technology
1900 South Price Road, Chandler AZ USA

Sunday, November 09, 2014

Home Automation by Edward Cheung

"This centralized system can control almost all of the lights in my home, a few appliances, the garden irrigation, some window treatments, the Audio/Video system, the security system, and the HVAC (Heating Ventilation and Air Conditioning)."

Home Automation by Edward Cheung

"This centralized system can control almost all of the lights in my home, a few appliances, the garden irrigation, some window treatments, the Audio/Video system, the security system, and the HVAC (Heating Ventilation and Air Conditioning)."

Home Automation by Edward Cheung

"I can communicate with the central computer by using keypads throughout the house, any phone in the world (including those inside the home), any browser over the internet, and from my wrist watch. A webcam (with integral pan/tilt) allows me to see what is happening with nothing but a web browser."

Thursday, November 06, 2014

SPICE Analog Simulation Program TINA TI

TINA is an easy-to-use, but powerful, circuit simulation program based on a SPICE engine. TINA-TI is a fully functional version of TINA, loaded with a library of TI macromodels plus passive and active models.
TINA-TI's new version 7.0 has changes from Version 6.0 in the following areas:

SPICE Analog Simulation Program TINA TI

SPICE Analog Simulation Program TINA TI

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages and waveforms. TINA's schematic capture is truly intuitive-a real "quickstart."
  • Provides support for switching power supply devices.
  • No limit to circuit size.
  • More SPICE models and example circuits included.
  • SMPS simulation capability.
  • Circuits developed in TINA-TI 7.0 will work with TINA Industrial version 7.
Application Schematic categories include:
  • Audio Op Amp Filters, Microphone Pre-Amplifiers
  • Control Loop for PI Temp Control and Current Loop 4-20mA
  • Signal Conditioner - Thermistor, Resistive Bridge, Capacitive Bridge
  • Reference Designs from device evaluation modules for SMPS Devices