Showing posts with label Microelectronics. Show all posts
Showing posts with label Microelectronics. Show all posts

Monday, January 16, 2017

Microsemi Corporation - High Performance Devices

Products  Microsemi Designs and Manufactures include high-performance, radiation-hardened and highly reliable analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; etc.

Microsemi Corporation - High Performance Devices

Zarlink and Actel are now part of  Microsemi. Actel have designed  SoCs and FPGAs based on flash and antifuse technologies.

Microsemi SmartFusion2 Starter Kit

Microsemi's SmartFusion2 Starter Kit

The SmartFusion2 starter kit supports industry-standard interfaces including Ethernet, USB, SPI, I2C and UART and includes a comprehensive breadboard to support unique design requirements.

"SmartFusion2 system-on-chip (SoC) FPGAs, which integrate inherently reliable flash-based FPGA fabric, a 166 MHz ARM Cortex-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM...."

They also provide High-performance IP Cores for other designers and chip developers.

Microsemi Corporation
One Enterprise Aliso Viejo, CA 92656 USA

Sunday, October 02, 2016

Rambus - IP Provider - Semiconductors

Technology licensing company. Manages and Provides Licenses to IP Intellectual property and Patents of semiconductor Technology. Founded in 1990.  XDR, DDR3, RDRAM and FlexIO are some of the Technology Solutions from Rambus.

Rambus - IP Provider - Semiconductors

"Beginning with edge-lit back lighting, Rambus has pioneered light guide-based design solutions for a broad range of LED lighting applications, enabling a new level of styling, efficiency and control of light."

LED lighting technology - Rambus

LED lighting technology

Rambus' lighting solutions enable manufacturers to use fewer or lower-cost LEDs in their general lighting products while delivering superior light quality and output.

Saturday, July 09, 2016

John Loomis – Computing and Engineering

Dr. John S. Loomis is the Associate Professor in the Electrical and Computer Engineering Department of The University of Dayton.

John Loomis - Course Web Pages

At the Course pages you can see subjects like Signal Processing, Digital Signal Processing, Analog Microelectronics Design and Electro-Optics.

The Altera DE2 board comes with a Control Panel facility that allows a user to access various components on the board through a USB connection from a host computer.

The DE2 Control Panel can be used to change the values displayed on 7-segment displays, light up LEDs, talk to the PS/2 keyboard, read/write the SRAM, Flash Memory and SDRAM, load an image pattern to display as VGA output, load music to the memory and play music via the audio DAC.

Altera DE2 Board

Altera DE2 Board and Projects with Nios II CPU

"The Altera Development and Education (DE2 ) board from Terasic Technologies Inc. is a wonderful vehicle for learning about digital logic, computer organization, and FPGAs. Featuring an Altera Cyclone II FPGA, the DE2 board offers varied technology suitable for university and college laboratory use, a wide range of design projects, as well as sophisticated digital system development tools."

Also see Microchip PIC32 - PIC32 Architecture and Programming

Wednesday, November 18, 2015

OpenCores design and publish core designs

"Our main objective is to design and publish core designs under a license for hardware modelled on the Lesser General Public License (LGPL) for software. We are committed to the ideal of freely available, freely usable and re-usable open source hardware. OpenCores.org"

OpenCores design and publish core designs

Subsidiary objectives
  • Develop standards for open source cores and platforms
  • Create tools and methods for development of open source cores and platforms
  • Develop open source cores and platforms
  • Provide documentation for these cores and platforms
These tools and methods should allow large, widespread, even international, teams to develop hardware in an open way.

UART to from fiber optic - OpenCores

UART to / from fiber optic

This core is well tested. They is two versions: -Fixed baudrate (0 to 2.5Mbit/s) - a full set of 2 transmitter and 2 receiver fit in a single XC9572XL CPLD -variable baudrate 50Mhz/n*p where n between 20 to 100 fiber optic baudrate and p>=1 baudrate divider.

Other Projects
  • Ethernet MAC 10/100 Mbps
  • USB 1.1 Host and Function IP core
  • OpenRISC 1000
  • CAN Protocol Controller
  • I2S Interface
  • SPDIF Interface

Wednesday, November 12, 2014

Amkor Technology - Semiconductor Services

A technology innovator in packaging and test solutions. The pakaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions.

They offer test services for many devices and designs that are used in Mordern day Electronic Gadgets that have application specific integrated circuits, memory devicea, and mixed signal and RF sections.

Amkor Technology - Semiconductor Services

Amkor also offers IC and Semiconductor Test Services. The also provide IC Package Design Services and complete turnkey solutions.

Amkor Flip Chip BGA (fcBGA) packages are assembled around state-of-the-art, single unit laminate or ceramic substrates.

Flip Chip BGA - Amkor Technology

This IC packaging technology is applicable for high pincount and / or high performance ASICs.

The variety of fcBGA package options allows package selection to be tailored to the specific thermal needs of the end product.

Flip Chip BGA - fcBGA

Amkor Technology
1900 South Price Road, Chandler AZ USA

Thursday, July 11, 2013

System-on-Chip - SoC - IP

When a product has to be made small, the board real estate is limited or it has to be manufactured in large numbers.... SoC is the Answer. A Microprocessor evolved into a Microcontroller by packing many external chips into one chip. Now uC Card along with the other blocks like A-D, Port Drivers, Networking elements, Display Driver and other peripherals can be packed into one chip.

Some Power Supply and RF blocks cannot be easily added inside as they have a silicon processing more specific to their applications. Laser trimmed Instrumentation Op-Amps, high accuracy resistor arrays, high value capacitors, magnetics and supporting chips are placed outside on the PCB.

The SOC can pack Digital Chips, Memory, A/D, D/A converters, uC, RAM and Custom programmable areas. For more specialized communications, analog and power requirements; Special SoC types can tackle RF and Power management within a chip because of proprietary silicon processing expertise.

System on a chip - Wiki

"A system on a chip or system on chip (SoC or SOC) is an integrated circuit (IC) that integrates all components of a computer or other electronic system into a single chip. It may contain digital, analog, mixed-signal, and often radio-frequency functions—all on a single chip substrate. A typical application is in the area of embedded systems."
System-on-Chip - SoC - IP

Programmable SoC offers an alternative to custom ASIC as you can make different products from the same chip, yet make products that are portable and low power. The software, pcb, user interface and support components has to be redesigned for every unique product. Many standard IPs are available for Design and Reuse.

Some of the early Philips (nxp) 8031 variations had integrated a lot of outer chips like A/D, D/A display driver etc. This made Programmable Industrial Instruments/Gadgets possible with just a few external components. Now many variations are available from chip manufacturers, with more speed, memory and peripherals inside. Futuristic gadgets may be intelligent, interactive, networked and portable. The SoC chip makes it all possible, by integrating all product functions within it except the user interface.

SoC with a Color LCD driver, Wi-Fi, USB, RAM and Flash capabilities....at last you have a Computer in a Chip. Better still Web-Chip.

Stratix IV FPGAs: Think AND, not OR

With 40 nm Stratix IV FPGAs you can reach new levels of system-on-a-chip (SoC) integration. Building on the advanced, proven Stratix III architecture, Stratix IV FPGAs deliver a high-density, feature-rich and high-performance core fabric. Combined with flexible I/Os, high-bandwidth transceivers, and memory interfaces,

Atmel AT91RM9200 is ARM920T-based

It has 16K-byte instruction and 16K-byte data cache memories, 16K bytes SRAM, 128K bytes ROM, External Bus Interface incl. SDRAM, Burst Flash and Static Memory Controllers, USB Device and Host Interfaces, Ethernet 10/100 BaseT MAC, Power Management Controller and much more...

More Reading

Friday, August 24, 2012

Avago Technologies Semiconductors

Analog, Mixed-signal and Optoelectronic Components and Subsystems

Avago Technologies Semiconductors 
 
Avago Technologies brings together the capabilities and track record of an established global leader with the "energy and responsiveness of a startup. We spent our first three decades as part of HP, ......"
  • Color Management & Sensors
  • ASICs
  • Motion Control Solutions
  • Light Emitting Diodes (LEDs)
  • Infrared Transceivers
  • Fiber Optics
Precision Optically Isolated Voltage Sensor

"Optical isolation amplifiers designed specifically for voltage sensing. Its 2V input range and high 1GΩ input impedance, makes it well suited for isolated voltage sensing requirements in electronic power converters applications including motor drives and renewable energy systems.."

Tuesday, July 24, 2012

Tensilica - Processor and DSP cores for SOC

Semiconductor IP supplier, Fast and low power 32-bit RISC microprocessor cores, Customizable processor and DSP core for SOC Design.

Tensilica - Processor and DSP cores for SOC

Dataplane Processor Units (DPUs) - Performance intensive DSP and embedded RISC processing functions.
Some Products Include -
  • HiFi Audio processor - the industry's most popular audio core processor with over 50 software packages for portable electronics and home theaters.
  • VDO Video processor - optimized for SD video with software for H.264 and other popular video standards

Xtensa LX4

Xtensa LX4 - Customizable Dataplane Cores Tailored for High-Performance DSP with Flexible I/Os

General Information -

DSP could be used in Audio, Video, 3D, Photos and Communications related functions. RISC Processor used in networking, embedded control, encryption, speedy computing.

Also see  - Linux on Xtensa

Thursday, May 24, 2012

CAST - IP Cores and Platforms

CAST develops and supports over 100 different popular and standards-based IP cores, including 8051s, H.264, PCI Express, AES, and even complete platforms for ARM-based SoCs.

CAST - IP Cores and Platforms

Electronic system designers use these popular and standards-based IP cores and platforms instead of designing their own.
  • Configurable: R8051XC
  • Z80-compatible
  • Hi-Speed USB (2.0)
  • smart card reader
  • ARM 7 TDMI bus
  • C8254 programmable
Talos Series Evaluation Kits

Talos Series Evaluation Kits for Microcontroller and Processor IP Cores The Talos Series of integrated hardware/software kits include everything you need to quickly and easily evaluate our microcontroller and processor cores in your own environment.

CAST, Inc.
11 Stonewall Court Woodcliff Lake, NJ 07677, USA.

Wednesday, May 02, 2012

ASIX Electronics Corporation - Fabless Semiconductors

ASIC and SoC for networking, communication and connectivity applications. ASIX was founded in May 1995 in Hsinchu Science Park. AX11025, Single Chip Microcontroller

ASIX Electronics Corporation - Fabless Semiconductors

  • Embedded Networking Solution: Fast Ethernet, Gigabit Ethernet
  • Bus Connecting Solution: USB 1.1, USB 2.0
  • Integrated SoC Solution

The AX11025, Single Chip Microcontroller with TCP/IP and 10/100M Fast Ethernet MAC/PHY, is a System-on-Chip (SoC) solution which offers a high performance embedded micro controller and rich communication peripherals for wide varieties of application which need access to the LAN or Internet.

Friday, January 07, 2011

Applied Materials - Nanomanufacturing

"A global leader in nanomanufacturing technology solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panels, solar photovoltaic cells, flexible electronics and energy efficient glass."

Applied Materials - Nanomanufacturing

Applied Materials' IP portfolio includes more than 8,000 patents worldwide and technologies.

Applied Materials - Nanomanufacturing

Applied Semitool HF Vapor Etch 

"The Semitool HF Vapor etch system is capable of releasing MEMS devices by removing sacrificial layers surrounding mechanical elements. Based on an isopropyl alcohol and hydrogen fluoride chemistry, the system delivers excellent uniformity, both within-wafer and from wafer to wafer, while preventing damage to the surrounding materials – essential for reliable MEMS device function."

Thursday, October 07, 2010

SOCcentral - ASIC FPGA EDA

Latest news about SOC/ASIC/FPGA design, EDA tools and design methodologies, intellectual property (IP), and design reuse
.
SOCcentral - ASIC FPGA EDA

You'll also find the abstracts (and links) to more than 1600 relevant magazine and newspaper articles, tutorials, whitepapers, and application notes available on line, as well as the most comprehensive directory of EDA/design service/IP providers available anywhere on the Internet.

Monday, June 14, 2010

Design And Reuse - System-On-Chip Design Resource

Design And Reuse - System-On-Chip Design Resource

Design And Reuse, The Web's System On Chip Design Resource : catalogs of IPs, Virtual Components, Cores, Embedded Software and Design Tools.

  • IP Reuse Station
  • SoC Collaborative Platform

Thursday, January 14, 2010

MOSIS - Affordable Integrated Circuits Fabrication

MOSIS Is An Multi-Project Wafer (MPW) Integrated Circuit (IC) Fabrication Service Provider.

MOSIS - Affordable Integrated Circuits Fabrication

"MOSIS is operated by the Information Sciences Institute at the University of Southern California (USC). MOSIS merges multiple IC designs submitted by both companies and universities onto multi-project wafers (MPW) to share the cost of fabrication among multiple users."

MOSIS - Affordable Integrated Circuits Fabrication

MOSIS - Metal Oxide Semiconductor Implementation Service

MOSIS keeps the cost of fabricating    prototype quantities low by aggregating multiple designs onto one mask set. This allows customers to share overhead costs associated with mask making, wafer fabrication, and assembly.

MOSIS Design Reference

A variety of design flows (digital, analog, mixed-signal) can be used with a number of different CAD tools, technology files, design kits, libraries and IP to create designs for processes accessed by MOSIS.

MOSIS Integrated Circuit Fabrication Service
USC Information Sciences Institute, 4676 Admiralty Way, 7th floor
Marina del Rey, CA 90292-6695, USA

Tuesday, December 08, 2009

Hendon Semiconductors - Microelectronics Design

Products include integrated circuits (silicon chips) in Bipolar, Bi-CMOS and CMOS technologies, thick film hybrids (ceramic substrate) and surface mounted printed circuit board assemblies and modules.

Hendon Semiconductors - Microelectronics Design

History -"The Hendon business site in Adelaide, South Australia has been a long established integrated circuit design and wafer fabrication facility in Australia, from its Philips semiconductor background up to 1997..."

Hendon Semiconductors - Microelectronics Design

Thick Film Hybrid Technology

The advantage of ceramic hybrids over fiberglass printed circuit is their high reliability due to their inherent rugged construction with the following advantages:

Hendon Semiconductors Pty. Ltd
ABN: 17 080 879 616, 1 Butler Drive, Hendon, South Australia 5014, Australia.    

Wednesday, November 04, 2009

Fujitsu Microelectronics Applications

Fujitsu Microelectronics Applications

Microcontrollers - 8-bit Series, 16-bit and 32-bit Series.

ASSPs - Power Management ICs

From Fujitsu

Friday, December 05, 2008

Principles of Semiconductor Devices

The purpose of this text is to explore the internal behavior of semiconductor devices, so that we can understand the relation between the device geometry and material parameters on one hand and the resulting electrical characteristics on the other hand.

Principles of Semiconductor Devices 

Principles of Semiconductor Devices  

"The Primary Focus: The MOSFET and CMOS Integrated Circuits The Metal-Oxide-Silicon Field-Effect-Transistor (MOSFET) is the main subject of this text, since it is already the prevailing device in microprocessors and memory circuits. In addition, the MOSFET is increasingly used in areas as diverse as mainframe computers and power electronics. The MOSFET’s advantages over other types of devices are its mature fabrication technology, its successful scaling characteristics and the combination of complementary MOSFETs yielding CMOS circuits."

Some of the Topics
  • Schottky diode current
  • Metal-Semiconductor contacts
  • Electrostatic analysis of a p-n diode
  • Reverse bias breakdown
  • Optoelectronic devices
  • Light Emitting Diodes (LEDs)
  • Ideal transistor model
  • MOSFET SPICE MODEL
  • Power MOSFETs